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Balance Copper

EasyEDA Pro extension — Automatically fills blank areas on PCB layers with non-functional copper patterns to balance copper density across layers, improving plating uniformity and manufacturing yield.

PCB	2D

Features

Supported Pattern Types

Core Capabilities

• Precise Clearance: Accurate avoidance for tracks (capsule shape), pads (actual shape + rotation), vias, copper pours, existing fills, and routing slots
• Footprint-aware: Parses footprint files to avoid pads (with rotation) and MULTI-layer routing slots (circle/rectangle/arbitrary polygon)
• DRC Spacing: Auto-reads DRC rule matrix, applies per-type clearance (track/pad/region/board edge)
• Stagger: Optional staggered row offset; layer stagger offsets adjacent layers by half a step
• Rotation: Arbitrary rotation angle for all patterns
• Target Layers: Current layer / All signal layers / All solder mask layers / Signal + mask
• Area Generate: Click two points on the canvas to define a fill region
• Auto DRC: Optionally run DRC check after generation completes
• Expression Input: Parameter inputs support arithmetic (e.g., 5+3 auto-evaluates to 8)
• Unit Adaptive: Auto-detects current EDA unit (mil/mm/inch) and converts accordingly
• Bilingual: Follows EDA language setting (Chinese / English)

Spacing

The spacing parameter is the gap between pattern edges, not center-to-center distance. Actual grid step = pattern size + spacing. Horizontal and vertical spacing can be set independently.

Installation

1. Download the latest .eext file from Releases
2. In EasyEDA Pro: Extensions → Manage Extensions → Install Local Extension
3. Select the downloaded .eext file

Usage

1. Open a PCB design document
2. Menu bar → Extensions → Balance Copper Tool → Balance Copper...
3. Select pattern type and configure parameters
4. Click "Generate" or "Area by Click"

License

Apache License 2.0